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ACS713
Fully Integrated, Hall Effect-Based Linear Current Sensor IC
with 2.1 kVRMS Isolation and a Low-Resistance Current Conductor
COMMON OPERATING CHARACTERISTICS 1 over full range of T A , and V CC = 5 V, unless otherwise specified
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Units
ELECTRICAL CHARACTERISTICS
Supply Voltage
V CC
4.5
5.0
5.5
V
Supply Current
Output Capacitance Load
Output Resistive Load
Primary Conductor Resistance
Rise Time
Frequency Bandwidth
Nonlinearity
Zero Current Output Voltage
Power-On Time
Magnetic Coupling 2
I CC
C LOAD
R LOAD
R PRIMARY
t r
f
E LIN
V IOUT(Q)
t PO
V CC = 5.0 V, output open
VIOUT to GND
VIOUT to GND
T A = 25°C
I P = I P (max), T A = 25°C, C OUT = 10 nF
–3 dB, T A = 25°C; I P is 10 A peak-to-peak
Over full range of I P , I P applied for 5 ms
Unidirectional; I P = 0 A, T A = 25°C
Output reaches 90% of steady-state level, no capacitor on
FILTER pin; T J = 25; 20 A present on leadframe
–
–
4.7
–
–
–
–
–
–
–
10
–
–
1.2
3.5
80
±1.5
V CC ×
0.1
35
12
13
10
–
–
–
–
–
–
–
–
mA
nF
k Ω
m Ω
μ s
kHz
%
V
μ s
G/A
Internal Filter Resistance 3
R F(INT)
1.7
k Ω
1 Device may be operated at higher primary current levels, I P , and ambient, T A , and internal leadframe temperatures, T A , provided that the Maximum
Junction Temperature, T J (max), is not exceeded.
2 1G = 0.1 mT.
3 R
F(INT) forms an RC circuit via the FILTER pin.
COMMON THERMAL CHARACTERISTICS 1
Min.
Typ.
Max.
Units
Operating Internal Leadframe Temperature
T A
E range
–40
–
85
°C
Value
Units
Junction-to-Lead Thermal Resistance 2
Junction-to-Ambient Thermal Resistance 2,3
R θ JL
R θ JA
Mounted on the Allegro ASEK 713 evaluation board
Mounted on the Allegro 85-0322 evaluation board, includes the power
consumed by the board
5
23
°C/W
°C/W
1 Additional
thermal information is available on the Allegro website.
2 The Allegro
evaluation board has 1500 mm 2 of 2 oz. copper on each side, connected to pins 1 and 2, and to pins 3 and 4, with thermal vias connect-
ing the layers. Performance values include the power consumed by the PCB. Further details on the board are available from the Frequently Asked
Questions document on our website. Further information about board design and thermal performance also can be found in the Applications Informa-
tion section of this datasheet.
3 R θ JA values shown in this table are typical values, measured on the Allegro evaluation board. The actual thermal performance depends on the actual
application board design, the airflow in the application, and thermal interactions between the device and surrounding components through the PCB and
the ambient air. To improve thermal performance, see our applications material on the Allegro website.
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
4
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